Sputtering targets
Bonded vs Unbonded Sputtering Targets
The correct configuration is determined by the cathode interface and the mechanical and thermal behaviour of the target—not only by material chemistry.
Unbonded targets
An unbonded target may be suitable where the cathode mechanically clamps the material and the target geometry and process load allow direct use. The complete mounting arrangement should still be checked.
Bonded assemblies
A backing plate can provide mechanical support and a controlled interface to the cathode. This is particularly relevant for brittle ceramic targets, larger geometries and assemblies defined by an existing drawing.
Information required
Supply the cathode model, target drawing, backing-plate material, maximum operating power, process temperature and whether an existing plate will be supplied for rebonding.
- Cathode drawing
- Target and backing dimensions
- Cooling configuration
- Operating power
- Maximum temperature
- New plate or rebonding