Sputtering targets
How to Specify a Sputtering Target
A material name and diameter rarely define a complete target. The cathode, target material and process conditions determine which dimensions, backing and bonding details must be confirmed.
Material definition
State the chemical formula or elemental composition and whether percentages are atomic or weight based. For doped and multicomponent targets, provide the acceptable composition tolerance.
- Material or formula
- Purity and critical impurity limits
- Atomic % or weight % basis
- Stoichiometry tolerance
Geometry and cathode interface
Provide a drawing whenever possible. Diameter alone does not define the assembly: thickness, edge profile, usable area, backing plate and mounting details may affect compatibility.
- Diameter or length × width
- Target thickness
- Edge, chamfer and corner requirements
- Backing-plate material and dimensions
Bonding and backing
Bonding suitability depends on target material, target size and operating conditions. Indium bonding, elastomer bonding or another approved route should be evaluated against process temperature and power rather than selected by name alone.
- Bonded or unbonded
- Existing backing plate availability
- Maximum process power or temperature
- Cooling and cathode information
Density and inspection
For ceramic and compound targets, density is an important supply parameter. Request the reporting basis—such as measured density or percentage of theoretical density—and agree any dimensional or bonding inspection documents before order.